Employment Type : Full-Time
Experience Level : Senior / 15+ Years
Department : Hardware Engineering / Imaging Systems
Job Summary
One of my clients is seeking a highly experienced Principal Hardware Design Engineer to lead the development of advanced PCB systems for day and thermal imaging platforms. This role is critical in delivering high-performance, ruggedized hardware for defense and surveillance applications, with a strong emphasis on signal integrity, environmental resilience, and system integration.
Core Responsibilities
* Lead schematic capture, PCB layout, and SPICE simulation using Altium Designer or similar tools.
* Design and develop PCBs for day and thermal camera systems, including sensor interfaces, power regulation, and digital processing modules.
* Create complex multilayer PCBs with high-speed video data transmission, using techniques such as blind / buried vias, via-in-pad, and BGA configurations.
* Ensure signal integrity and minimize crosstalk through effective analog / digital domain separation.
* Develop ruggedized PCBs for harsh environmental conditions typical in defense and surveillance.
* Design power distribution systems with a focus on low noise, thermal management, and EMC.
* Integrate interface standards such as MIPI CSI, LVDS, HDMI, and USB into camera modules.
* Implement EMI / ESD protection, grounding schemes, and shielding for high-sensitivity imaging systems.
* Generate complete manufacturing documentation including BOMs, Gerber files, assembly drawings, and test plans.
* Collaborate with firmware and optics teams to ensure alignment with calibration, synchronization, and system integration.
* Mentor junior engineers and support peer reviews and validation processes.
* Utilize lab tools (e.g., logic analyzers, oscilloscopes, thermal cameras) for debugging and validation.
Supporting Responsibilities
* Work with microcontroller, FPGA, and ISP architectures for camera control and data handling.
* Support integration of thermal sensors (e.g., ULIS, FLIR) and visible image sensors into embedded systems.
* Apply thermal management techniques and temperature compensation for IR camera hardware.
* Conduct hardware bring-up, calibration board support, and sensor alignment.
* Collaborate with systems engineering and testing teams during lab and field trials.
Required Qualifications
* Bachelor’s or Master’s degree in Electrical or Electronics Engineering.
* 15+ years of experience in hardware design, with a strong focus on imaging systems and PCB development.
* Proven track record of successful PCB designs in defense or ruggedized environments.
* Deep knowledge of Altium Designer and hardware troubleshooting.
Key Skills
* Digital Electronics : Strong foundation in digital circuit design and signal processing.
* High-Speed Data Handling : Experience with high-bandwidth video and data interfaces.
* Thermal & Day Camera Design : Specialized knowledge in imaging hardware for surveillance and defense.
* Altium Designer : Expert-level proficiency in schematic capture, layout, and simulation.
* Defense Industry : Familiarity with ruggedization, MIL-STD compliance, and environmental constraints.
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