OUR STORY At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today. When you join ST, you will be part of a global business of more than 115 nationalities and present in 40 countries, 50,000, diverse and dedicated creators & makers of technology around the world! Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation - whilst unlocking your own potential. Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future! YOUR ROLE As part of BEM&T (Back End Manufacturing & Technology), the Package R&D is in charge of developing new packages for integrated circuits and related assembly technologies; within Package R&D Team, the package designer has the responsibility to design a new package and lead its development from technical viewpoint in cooperation with other Package R&D functions. With the goal to reinforce the team dedicated to QFN package platform, we are looking for a dynamic engineer whose responsibilities will include: - Design the new requested package according to the established design rules to fulfill the customer's requirements in term of quality, timing and cost. - Act as Technical Project Leader leading the technical project content in coordination with the assigned Program Manager. - Work in synergy with: - Technology Engineering team for package materials selection and the development or validation of assembly technologies. - Material Characterization & Measurement Lab for package related stress test, package characterization and relevant measurements - Interface with internal & external customer, assembly plants and central functions during the project execution through the maturity steps of package development process from feasibility to release to production. - Attend and drive on regular basis meetings/calls to update the stakeholders about the project progress YOUR SKILLS & EXPERIENCES - Bachelor/Master degree in Mechanical Engineering or similar - Proficiency in the use of Autodesk AutoCAD and Inventor - Proficiency in the use of Microsoft Office suite - Excellent problem-solving and analytical skills - Strong communication and teamwork abilities - Good attitude to interpersonal relationship - Ability to manage multiple tasks and prioritize effectively in a dynamic environment - Previous experience in similar role is a plus - Knowledge of semiconductor packaging is a plus - Fluent in English Joining us is also about a greater work-life balance and workplace with equal opportunities. Dedicated Employee Resource Groups for women and LGBTQIA, hybrid work arrangements are amongst the many DEI & Sustainability initiatives that make us a great place to evolve your career.