Our innovative start-up, developing ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications, is seeking an Advanced Packaging Engineer to lead device packaging projects and roadmaps. The role involves developing 2.5/3D advanced packaging solutions and collaborating with OSATs throughout the cycle of concept exploration, design, DFM, engineering runs, development, and quality/reliability. Managing the internal packaging team and driving overall package development within the company are key responsibilities. This position can be worked remotely. Required skills: Strong semiconductor packaging experience and knowledge Expertise in 2.5/3D advanced packaging solutions Excellent communication skills and team management abilities Experience liaising with OSATs Degree qualification Please contact Rachel Anderson for further details. J-18808-Ljbffr