Location: Abu Dhabi, UAE – Relocation Required
Employment Type: Full-Time
Experience Level: Senior / 15+ Years
Department: Hardware Engineering / Imaging Systems
Job Summary
One of my clients is seeking a highly experienced Principal Hardware Design Engineer to lead the development of advanced PCB systems for day and thermal imaging platforms. This role is critical in delivering high-performance, ruggedized hardware for defense and surveillance applications, with a strong emphasis on signal integrity, environmental resilience, and system integration.
Core Responsibilities
Lead schematic capture, PCB layout, and SPICE simulation using Altium Designer or similar tools.
Design and develop PCBs for day and thermal camera systems, including sensor interfaces, power regulation, and digital processing modules.
Create complex multilayer PCBs with high-speed video data transmission, using techniques such as blind/buried vias, via-in-pad, and BGA configurations.
Ensure signal integrity and minimize crosstalk through effective analog/digital domain separation.
Develop ruggedized PCBs for harsh environmental conditions typical in defense and surveillance.
Design power distribution systems with a focus on low noise, thermal management, and EMC.
Integrate interface standards such as MIPI CSI, LVDS, HDMI, and USB into camera modules.
Implement EMI/ESD protection, grounding schemes, and shielding for high-sensitivity imaging systems.
Generate complete manufacturing documentation including BOMs, Gerber files, assembly drawings, and test plans.
Collaborate with firmware and optics teams to ensure alignment with calibration, synchronization, and system integration.
Mentor junior engineers and support peer reviews and validation processes.
Utilize lab tools (e.g., logic analyzers, oscilloscopes, thermal cameras) for debugging and validation.
Supporting Responsibilities
Work with microcontroller, FPGA, and ISP architectures for camera control and data handling.
Support integration of thermal sensors (e.g., ULIS, FLIR) and visible image sensors into embedded systems.
Apply thermal management techniques and temperature compensation for IR camera hardware.
Conduct hardware bring-up, calibration board support, and sensor alignment.
Collaborate with systems engineering and testing teams during lab and field trials.
Required Qualifications
Bachelor’s or Master’s degree in Electrical or Electronics Engineering.
15+ years of experience in hardware design, with a strong focus on imaging systems and PCB development.
Proven track record of successful PCB designs in defense or ruggedized environments.
Deep knowledge of Altium Designer and hardware troubleshooting.
Key Skills
Digital Electronics: Strong foundation in digital circuit design and signal processing.
High-Speed Data Handling: Experience with high-bandwidth video and data interfaces.
Thermal & Day Camera Design: Specialized knowledge in imaging hardware for surveillance and defense.
Altium Designer: Expert-level proficiency in schematic capture, layout, and simulation.
Defense Industry: Familiarity with ruggedization, MIL-STD compliance, and environmental constraints.