Ph3Mechanical Engineer Space Electronics Assemblies /h3 pbARESYS /b is an Italian SME providing innovative satellite-based sensing solutions to the bSpace and Defense /bmarkets. /p pbARESYS /b offers a 20+ years of expertise in designing and developing bon-board /band bon-ground /bsystems with a vertical specialization inbmicrowawe ( bRadar, SAR) and Optical /btechnologies. /p pWe are seeking a skilled bMechanical Engineer /bto join our team and contribute to the design and integration of mechanical structures for space electronic assemblies, including hous enclosures, thermal interfaces, mechanical supports, and brackets. /p pThe ideal candidate will have hands‑on experience in the bdesign of hardware for harsh environments /b (space vacuum, vibration, thermal extremes) and will work in close collaboration with electronics, thermal, and systems engineering teams. /p pbMain tasks and responsibilities: /b /p ul li3D 2D mechanical design of structures and interfaces for space‑grade electronic units (boxes, heatsinks, mounting interfaces, connector panels, etc.). /li liCreation of mechanical drawings and technical documentation (BoMs, manufacturing drawings, tolerances, DFM considerations). /li liCollaboration with electronic designers to ensure proper mechanical and thermal integration of PCBs, connectors, and shields. /li liMaterial selection and specification of finishes treatments suitable for space (e.g., low‑outgassing, CTE compatibility, corrosion resistance). /li liLiaising with suppliers, mechanical workshops, and prototyping partners. /li liParticipation in environmental testing campaigns (vibration, TVAC, shock), including mechanical test setup preparation. /li liContribution to technical design reviews (PDR, CDR) and product configuration control. /li /ul pbRequired skills: /b /p ul liFamiliarity with space‑related norms and standards (ECSS preferred). /li liProficient in 3D CAD modeling and 2D drawing generation. /li liBasic knowledge of structural and thermal simulation tools (FEA FEM). /li liUnderstanding of thermal, EMC, and mechanical constraints in electronic packaging. /li liExperience designing for harsh environments (low mass, high vibration, thermal gradients, radiation). /li liExperience with real space missions (e.g., CubeSat, SmallSat, satellite payloads). /li liKnowledge of ECSS standards (e.g., ECSS‑E‑ST‑32, ECSS‑Q‑ST‑70). /li liExperience with FEA tools (e.g., ANSYS, COMSOL, NASTRAN). /li liFamiliarity with documentation workflows for ESA NASA missions. /li /ul pbSoft‑skills: /b /p ul liHigh attention to detail, autonomy, and practical problem‑solving. /li liAbility to work in multidisciplinary teams. /li /ul pbYour background: /b /p ul liMaster’s degree in Mechanical Engineering or equivalent. /li liMinimum 3 years of experience in mechanical design of electronic systems (ideally in space, aerospace, or high‑end automotive sectors). /li liGood communication skills in English (B2 or higher) /li /ul h3bWhat We Offer: /b /h3 ul liInvolvement in cutting‑edge projects in the aerospace domain. /li liCollaborative and highly technical environment. /li liOpportunities for professional growth and specialization space‑grade mechanical design. /li liCompetitive compensation aligned with experience /li /ul pOur organization operates in accordance with gender equality and is committed to supporting inclusivity and diversity. /p pPlease submit your application without providing information about marriage, pregnancy, or family responsibilities.br/Applications must not contain information about the family status of candidates or any pregnancy. /p /p #J-18808-Ljbffr