H3Power Integrity Engineer (RD Engineer of board/module high-current PDN) /h3pJoin to apply for the strongPower Integrity Engineer (RD Engineer of board/module high-current PDN) /strong role at strongHuawei Italy Research Centers /strong. /ph3About Huawei /h3pHuawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We focus on telecom networks, IT, smart devices, and cloud services, aiming to create a fully connected, intelligent world. With over 200,000 employees, 55% in RD, and operations in more than 170 countries, we invest over 20% of revenues in RD annually, with total investments exceeding 150 billion USD in the past decade. By the end of 2023, Huawei held over 140,000 active patents. /ph3Our Culture and Values /h3ulliCustomer-centric, innovative, and committed to continuous improvement. /liliFast execution with high standards. /liliMulticultural, informal, and collaborative environment. /liliOwnership-driven, open to ideas, and results-oriented. /li /ulh3The Opportunity /h3pWe seek a talented strongPower Integrity Engineer /strong to explore board-level high-current PDN technologies, electromigration, and performance evaluation of microstructures such as power planes, BGA balls, and vias. /ph3Key Responsibilities /h3ulliResearch innovative low-loss, high-current power supply architectures and improve electromigration and through-current capabilities of 1000 A+ PDNs. /liliLead board-level PDN technology development for large current and energy efficiency, supporting next-gen CPUs. /liliDevelop simulation and testing capabilities for electromigration of PDN microstructures under low voltage and high current. /li /ulh3Minimum Qualifications /h3ulliMaster's degree or higher in Electrical Engineering, Computer Engineering, or Computer Science; PhD preferred. /liliExperience in developing power supply systems for large chips and CPUs, with deep understanding of board-level power architecture and PDN design. /liliKnowledge of simulation/testing of high-current electromigration and PCB microstructure (vias, BGA). /liliExcellent communication skills and willingness to travel. /liliFluent in English. /li /ulh3Location /h3pHuawei Milan Research Center, working on cutting-edge microwave and millimeter-wave communications, optical RFICs, and high-frequency technologies. /ph3What We Offer /h3pAn exciting career in a leading multinational, with challenging work, competitive salary, and training opportunities across Europe and beyond. /p #J-18808-Ljbffr