Social network you want to login/join with: R&D – Head of Embedded NVM Technologies, Cremona Client: Theron Solutions Location: Cremona, Italy Job Category: Other EU work permit required: Yes Job Reference: 4287033516446711808337134 Job Views: 2 Posted: 26.04.2025 Expiry Date: 10.06.2025 Job Description: THIS ROLE REQUIRES A RELOCATION TO DHOLERA, INDIA once the FAB is built. Responsibilities: Integration responsibilities to add eNVM (embedded Non Volatile Memory) features to 28 110nm platform technologies including MTP and Flash. Work with IP providers, as needed, to implement these features. Design and layout of test chips to aid in device/technology optimization, reliability assessment, and SPICE model extraction. End-to-end project management from initial project justification to final qualification and yield ramp, with responsibilities for achieving performance, quality/yield, schedule, and cost targets. Build and lead a cross-functional team across diverse geographies. Build strong customer relationships based on confidence in the company's technical capabilities. Conduct competitor benchmarking; own the technology roadmap. Present to internal and customer senior executives. Possible involvement in OTP development. Travel (a few weeks per quarter). Qualifications and skills: Ability to manage, mentor, and lead a team of highly motivated professionals. Ability to work independently, self-motivated with a strong drive to succeed. Team player capable of working across diverse cross-functional teams worldwide. Leadership skills to influence all organizational levels. Inclusive approach, adapting to various situations and cultural norms. Avid learner, curious, resilient, and data-driven. Collaborative, relationship-builder, supportive, and open to new ideas. Innovative, creative, and adaptable to change. Qualifications: M.S or PhD in Electrical Engineering, Materials Science, or equivalent. Strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, and analytical techniques. Deep knowledge of key eNVM technologies (charge trap, floating gate, RRAM, MRAM, etc.). Understanding of technology parameters and figures of merit (bit cell size, macro size, endurance, retention, power, latency, mask count, etc.) and experience in achieving competitive performance. Proven track record in delivering these technologies into volume manufacturing. Ability to lead cross-functional teams to complete projects on time and within budget. Experience working across cultures and geographies. Good team player with an innovation and competitive mindset. Desired Experience Level: 15 years in the semiconductor industry. Successful track record of developing new technologies into high-volume production. Strong problem-solving skills using design of experiments and analytical tools. EOE: Our client is an Equal Opportunity Employer and prohibits discrimination and harassment of any kind. We are committed to providing a work environment free of discrimination and harassment, making employment decisions based on business needs, job requirements, and individual qualifications, without regard to race, color, religion, sex, age, disability, sexual orientation, gender identity, marital status, military service, family medical history, genetic information, or any other protected status. J-18808-Ljbffr