Senior Hardware Design Engineer
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This is a critical role in the development of advanced PCB systems for day and thermal imaging platforms.
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The ideal candidate will have a strong focus on signal integrity, environmental resilience, and system integration.
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Key Responsibilities:
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1. Lead schematic capture, PCB layout, and SPICE simulation using Altium Designer or similar tools.
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2. Design and develop PCBs for day and thermal camera systems, including sensor interfaces, power regulation, and digital processing modules.
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3. Create complex multilayer PCBs with high-speed video data transmission, using techniques such as blind/buried vias, via-in-pad, and BGA configurations.
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4. Ensure signal integrity and minimize crosstalk through effective analog/digital domain separation.
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5. Develop ruggedized PCBs for harsh environmental conditions typical in defense and surveillance.
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6. Design power distribution systems with a focus on low noise, thermal management, and EMC.
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7. Integrate interface standards such as MIPI CSI, LVDS, HDMI, and USB into camera modules.
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8. Implement EMI/ESD protection, grounding schemes, and shielding for high-sensitivity imaging systems.
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9. Generate complete manufacturing documentation including BOMs, Gerber files, assembly drawings, and test plans.
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10. Collaborate with firmware and optics teams to ensure alignment with calibration, synchronization, and system integration.
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11. Mentor junior engineers and support peer reviews and validation processes.
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12. Utilize lab tools (e.g., logic analyzers, oscilloscopes, thermal cameras) for debugging and validation.
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