About Huawei Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. With integrated solutions across four key domains – telecom networks, IT, smart devices, and cloud services – we are committed to bringing digital to every person, home and organization for a fully connected, intelligent world.
At Huawei, innovation focuses on customer needs. We invest heavily in basic research, concentrating on technological breakthroughs that drive the world forward. We have more than 200,000 employees, of which 55% are employed in R&D;, and we operate in more than 170 countries and regions.
Huawei invests more than 20% of revenues in R&D; every year: in the past 10 years our total R&D; investments exceed 150B USD.
By the end of 2023, Huawei held +140,000 active patents.
Find out more about Huawei Research and Development at
end-to-end portfolio of products, solutions and services are both competitive and secure. Through open collaboration with ecosystem partners, we create lasting value for our customers, working to empower people, enrich home life, and inspire innovation in organizations of all shapes and sizes.
Who we are
Our motto is "make it possible", we use our customer‑centric obsession, our perseverance, our dedication and a continuous self‑challenge to accomplish the most challenging goals and always raise the bar!
We think and execute very fast, but we are never superficial and always guarantee the highest standards.
We are obsessed about continuous improvement and about creating value for the company, for the employees and for society.
We are like a big multicultural family where relationships are informal and direct and where cooperation and support are our daily keywords.
We are a place where "results talk and ideas walk", good ideas are always welcome, but you have to take ownership and make them happen too.
Openness and flexibility are our mantra.
The Opportunity We are looking for an Engineer expert on Printed Circuit Boards novel technologies, process and materials.
You will be responsible for leading the innovation of the Printed Circuit Board technology and related industrial process in order to support the high‑speed interconnection scenario. In this position you should be able to expand on the state of the art of PCB technology, addressing new core materials (e.g. glass, polymers, etc.) and the related manufacturing process challenges (reliability, mechanical stability, EM response stability, repeatability, integration etc.).
Type of Contract:
1‑year temporary contract with our outsourcing partner Randstad Italia, with the possibility of long‑term employment afterwards.
What will be your main responsibilities?
Support the Lab by identifying the feasible technologies, materials and industrial process limitations to improve on the current state‑of‑the‑art of printed circuit board technology in terms of signal routing density, insertion loss of traces, maximum bandwidth and overall reliability, for high‑speed interconnection scenario;
Special focus should be placed into developing novel technologies (also through the support of suitably identified technical partners) to facilitate the integration of complex systems with multiple, tightly interconnected modules/packages, while at the same time addressing specific problems such as mechanical stability, interconnections optimization, bandwidth improvement and insertion loss minimization;
Work in close collaboration with the EM modelling team and the RF design team, as part of the Board and Module Engineering Lab, to drive the development of novel technical solution while taking technological and engineering constraints into