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Power integrity engineer (r&d engineer of board/module high-current pdn)

Vimodrone
Huawei Italy Research Centers
50.000 € - 70.000 € all'anno
Pubblicato il 12 settembre
Descrizione

Power Integrity Engineer (R&D Engineer of board/module high-current PDN) Join to apply for the Power Integrity Engineer (R&D Engineer of board/module high-current PDN) role at Huawei Italy Research Centers. About Huawei Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We focus on telecom networks, IT, smart devices, and cloud services, aiming to create a fully connected, intelligent world. With over 200,000 employees, 55% in R&D, and operations in more than 170 countries, we invest over 20% of revenues in R&D annually, with total investments exceeding 150 billion USD in the past decade. By the end of 2023, Huawei held over 140,000 active patents. Our Culture and Values Customer-centric, innovative, and committed to continuous improvement. Fast execution with high standards. Multicultural, informal, and collaborative environment. Ownership-driven, open to ideas, and results-oriented. The Opportunity We seek a talented Power Integrity Engineer to explore board-level high-current PDN technologies, electromigration, and performance evaluation of microstructures such as power planes, BGA balls, and vias. Key Responsibilities Research innovative low-loss, high-current power supply architectures and improve electromigration and through-current capabilities of 1000 A PDNs. Lead board-level PDN technology development for large current and energy efficiency, supporting next-gen CPUs. Develop simulation and testing capabilities for electromigration of PDN microstructures under low voltage and high current. Minimum Qualifications Master's degree or higher in Electrical Engineering, Computer Engineering, or Computer Science; PhD preferred. Experience in developing power supply systems for large chips and CPUs, with deep understanding of board-level power architecture and PDN design. Knowledge of simulation/testing of high-current electromigration and PCB microstructure (vias, BGA). Excellent communication skills and willingness to travel. Fluent in English. Location Huawei Milan Research Center, working on cutting-edge microwave and millimeter-wave communications, optical RFICs, and high-frequency technologies. What We Offer An exciting career in a leading multinational, with challenging work, competitive salary, and training opportunities across Europe and beyond. J-18808-Ljbffr

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