PJoin to apply for the strongAdvanced Packaging Engineer - Staff /strongrole at strongTDK InvenSense /strong /pp3 days ago Be among the first 25 applicants /ppJoin to apply for the strongAdvanced Packaging Engineer - Staff /strongrole at strongTDK InvenSense /strong /ppDirect message the job poster from TDK InvenSense /ppFounded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, audio and location platforms, and services can be found in many of the world’s largest and most iconic brands including smartphones, tablets, wearables, drones, gaming devices, internet of things, automotive products, and remote controls for smart TVs. /ppInvenSense is headquartered in San Jose, CA, and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia, and Italy. We’re looking for top-notch innovators to join our global team. If you’re interested in being a part of our journey and helping us grow to become the leading provider of SoC platform solutions, we want to hear from you. /ppstrongAbout the Role /strong /ppWork in the TDK InvenSense Core Technology Packaging team providing leadership in the areas of package simulation and module level analysis supporting NPI assembly and technology development for all our motion products. The scope of work includes 3D model generation, material characterization, mechanical simulations (static, dynamic, linear, non-linear analyses), thermal and thermomechanical simulations, electromagnetic and coupled Multiphysics simulations. You will be expected to work closely with MEMS design, assembly and validation teams to explore new materials and new assembly methods for MEMS motion sensors. The job will involve close interaction with cross-functional teams across the company, overseas manufacturing houses (OSATs), and as well as close interactions with internal external customers. /ppstrongJob Qualifications /strong /pulliMS or Ph.D. in Mechanical Engineering, Electrical or MEMS Engineering, Physics, or similar discipline /lili5+ years of experience with simulation in the field of MEMS, ideally MEMS packaging (e.g. accelerometer, gyroscope, microphone, and magnetometer) /liliStrong expertise in FEM/cross domain/multiphysics simulations (e.g. die/package/socket interactions, thermo-mechanical and electromagnetic simulations) /liliStrong skills in using modeling and simulation, programming and 2D/3D CAD software tools (Ex: Ansys, Comsol, APDL, Matlab, Python, AutoCAD, SolidWorks, Inventor) /liliAbility to analyze/validate, interpret and effectively communicate simulation results to stakeholders both verbally and in presentations /liliBroad knowledge of semiconductor/MEMS materials (including characterization), microelectronics and assembly processes /liliPrefer experience working with suppliers/OSATs, NPI, in high volume manufacturing environment /liliPrefer working knowledge of statistical process control and statistical tolerance analyses /liliAbility to work in an internationally distributed, fast-paced, product focused environment /li /ulpstrongPossible locations: Milan (Assago), Munich. /strong /ph3Seniority level /h3ullih3Seniority level /h3Associate /li /ulh3Employment type /h3ullih3Employment type /h3Full-time /li /ulh3Job function /h3ullih3Job function /h3Research and Engineering /lilih3Industries /h3Semiconductor Manufacturing /li /ulpReferrals increase your chances of interviewing at TDK InvenSense by 2x /ph3Sign in to set job alerts for “Packaging Engineer” roles. /h3h3Mechanical Design Engineer - Packaging Food Pharma /h3h3RD Packaging Sustainability Compliance Senior Specialist /h3h3QC and Packaging Development Senior Specialist /h3h3Strategic Account Manager - Packaging Adhesives /h3h3PRODUCTION PLANNER SETTORE PACKAGING/CARTOTECNICO - MAGENTA /h3pNovate Milanese, Lombardy, Italy 2 weeks ago /ph3Project Process Engineer - Chimica Semiconduttori /h3h3Process Engineer - Dry Anaerobic Digestion /h3h3Italy Internship Supply Chain Process Engineer Assistant /h3h3Process Engineer - (Offshore) - Energy, Oil Gas Project /h3pWe’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI. /p #J-18808-Ljbffr