About Huawei Huawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. With integrated solutions across four key domains – telecom networks, IT, smart devices, and cloud services – we are committed to bringing digital to every person, home and organization for a fully connected, intelligent world. At Huawei, innovation focuses on customer needs. We invest heavily in basic research, concentrating on technological breakthroughs that drive the world forward. We have more than 200,000 employees, of which 55% are employed in R&D, and we operate in more than 170 countries and regions. Huawei invests more than 20% of revenues in R&D every year: in the past 10 years our total R&D investments exceed 150B USD. By the end of 2025, Huawei held +150.000 active patents. Who we are
Our motto is "make it possible", we use our customer‑centric obsession, our perseverance, our dedication and a continuous self‑challenge to accomplish the most challenging goals and always raise the bar! We think and execute very fast, but we are never superficial and always guarantee the highest standards. We are obsessed about continuous improvement and about creating value for the company, for the employees and for society. We are a multicultural team where relationships are informal and direct and where cooperation and support are our daily keywords. We are a place where "results talk and ideas walk", good ideas are always welcome, but you have to take ownership and make them happen too. Openness and flexibility are our mantra.
The opportunity Huawei Milan Research Center is looking for a Silicon Photonics Design Expert who will lead silicon photonic chip architecture definition and drive breakthroughs in optoelectronic integration for next‑generation optical communication systems. You will work in a fast‑paced international team engaged in state of the art research and innovation. If you are enthusiastic in facing new challenges and in top‑notch technologies, have a further look! Key Responsibilities
Gain insight into the development trend in the optical communication field and build the continuous competitiveness of the silicon photonic technology in short‑distance optical interconnection and coherent optical communication. Lead the definition of the silicon photonic chip architecture in the high‑density optoelectronic integration and multi‑material hybrid integration system, and make breakthroughs in the performance of key active/passive components. Lead the joint optoelectronic design, including the joint optimization of modulators/detectors and DRV/TIA. Take the lead in optoelectronic high‑speed signal integrity optimization in the 2.5D/3D advanced package architecture. Work closely with the solution, process, and packaging teams to ensure the implementation of the technical architecture and technical points.
Required Qualifications
At least 5 years of silicon photonic design experience, with a proven track record of successful product development and tape outs. Proficient in active and passive optical design as well as high speed signal integrity design. Experience in high‑density optoelectronic integration and chip‑package co‑design is preferred. Experience in developing silicon photonics products with advanced packaging is preferred. Deeply understand silicon photonics technology trends and be able to identify key technical directions. Good communication skills, ability to work in multi‑cultural environments, strong team working attitude. Fluent in English and availability to travel outside Italy.
Huawei Milan Research Center This position is based in Huawei Milan Research Center. At our Research Center we work on cutting‑edge technologies in microwave and millimeter‑wave communications, focusing on frequency bands such as E-Band, W-Band, and D-Band. Our research extends to free‑space optical communications, advanced system architectures, antenna technologies, and contributions to standardization efforts. We also develop active phased array systems, focusing on innovative architectures and antenna array technologies. Additionally, we are engaged in research on optical RFICs, including drivers and transimpedance amplifiers (TIAs), as well as microwave and millimeter‑wave IC used in power amplifiers and front‑end technologies. Our research also covers HF technologies, advanced electromagnetics (EM), and also power integrity and high speed signal integrity in next‑generation systems. What We Offer We offer you an exciting professional career in one of the leading and fastest growing multinational telecommunication companies, challenging work and a competitive salary package. Personal development is ensured through many training opportunities in Western Europe and abroad. Equal Opportunity Huawei is an Equal Opportunity Employer and does not discriminate based on race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, genetic information, or any other legally protected status. All qualified applicants will receive consideration for employment without regard to these characteristics. We are committed to creating an inclusive and diverse workplace. #J-18808-Ljbffr