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Power integrity engineer (r&d engineer of board/module high-current pdn)

Vimodrone
Huawei Italy Research Centers
Pubblicato il Pubblicato 29min fa
Descrizione

Power Integrity Engineer (RD Engineer of board/module high-current PDN)Join to apply for the Power Integrity Engineer (RD Engineer of board/module high-current PDN) role at Huawei Italy Research Centers.About HuaweiHuawei is a leading global provider of information and communications technology (ICT) infrastructure and smart devices. We focus on telecom networks, IT, smart devices, and cloud services, aiming to create a fully connected, intelligent world. With over 200,000 employees, 55% in RD, and operations in more than 170 countries, we invest over 20% of revenues in RD annually, with total investments exceeding 150 billion USD in the past decade. By the end of 2023, Huawei held over 140,000 active patents.Our Culture and ValuesCustomer-centric, innovative, and committed to continuous improvement.Fast execution with high standards.Multicultural, informal, and collaborative environment.Ownership-driven, open to ideas, and results-oriented.The OpportunityWe seek a talented Power Integrity Engineer to explore board-level high-current PDN technologies, electromigration, and performance evaluation of microstructures such as power planes, BGA balls, and vias.Key ResponsibilitiesResearch innovative low-loss, high-current power supply architectures and improve electromigration and through-current capabilities of 1000 A+ PDNs.Lead board-level PDN technology development for large current and energy efficiency, supporting next-gen CPUs.Develop simulation and testing capabilities for electromigration of PDN microstructures under low voltage and high current.Minimum QualificationsMaster's degree or higher in Electrical Engineering, Computer Engineering, or Computer Science; PhD preferred.Experience in developing power supply systems for large chips and CPUs, with deep understanding of board-level power architecture and PDN design.Knowledge of simulation/testing of high-current electromigration and PCB microstructure (vias, BGA).Excellent communication skills and willingness to travel.Fluent in English.LocationHuawei Milan Research Center, working on cutting-edge microwave and millimeter-wave communications, optical RFICs, and high-frequency technologies.What We OfferAn exciting career in a leading multinational, with challenging work, competitive salary, and training opportunities across Europe and beyond.
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